Rapid changes in information technologies have lead to a boost in the strength and efficiency of human activity. These technologies have an influence on every area of human life, including education, science, business, leisure time, entertainment, government, and health care. Human life is greatly dependent on these systems’ efficiency and performance. The HSI conference has been prepared as a platform for exchanging ideas, knowledge, skills, and experiences in interactions between man and these systems. The HSI conference series has become the very important international conference in the field of Human System Interactions, human system science and engineering, human factors in large complex systems, human space computing and cyber-physical systems, human-environment interactions, and social‐technical systems. This 13th international conference on Human System Interaction will be held in Tokyo, Japan from the 6th to 8th June 2020. The conference will cover the theory, design, and application of human‐system interactions in the areas of science, education, business, industry, services, humanity, environment, health, and government. Aside from the regular presentations, the conference will include keynote addresses from speakers who work both in industry and academia and expects to attract more than 120 participants. Prospective authors are invited to submit papers on any of the topics listed below:
Apart from the aforementioned topics, the conference will include Special Sessions on highly specialized topic areas reporting technical trends and breakthroughs in human-system interaction. We cordially invite you to organize special sessions. Papers in these sessions undergo a regular review process as those in general sessions.
|Special session proposal deadline:||January 15, 2020|
|Full paper submission deadline:||February 15, 2020|
|Notification of acceptance:||March 15,2020|
|Final paper submission:||April 5, 2020|
|Conference time:||June 6-8, 2020|
All papers presented during the conference will be submitted to IEEE Xplore. Previous papers: http://ieeexplore.ieee.org/servlet/opac?punumber=1002118